Another hole has given a first gander at MediaTek’s cutting edge lead chipset, the replacement to the new Dimensity 900 which could be marked as the Dimensity 10000. The SoC looks set to be based on TSMC’s 3 nm, and is relied upon to do fight with Qualcomm’s Snapdragon 8 Gen 2.
MediaTek formally sent off the Dimensity 9000 on December 16. While the chipset is yet to advance toward any smartphone available, it as of now has a few takers, and seems to be a preferable chipset over Qualcomm’s Snapdragon 8 Gen 1. MediaTek isn’t laying on those honestly shaky trees, notwithstanding, and is evidently previously anticipating its cutting edge leader chipset, a SoC expected to be marked as the Dimensity 10000.
As per Equal Leaks, MediaTek plans to send off a new chipset as the replacement to the Dimensity 9000. The chipset’s name is presently obscure however considering the organization has both the Dimensity 8000 and Dimensity 9000 in its present setup, any reasonable person would agree that it very well may be marked as the Dimensity 10000.
Evidently, the Dimensity 10000 will be based on TSMC’s new 3 nm hub. That would make it a generational update on the 4 nm process supporting the Dimensity 9000. TSMC guarantees 30% lower power utilization versus its 5 nm process.
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Expecting all of this is exact, the Dimensity 10000 will be pointed directly at the throat of Qualcomm’s Snapdragon 8 Gen 2. The Snapdragon 8 Gen 1’s replacement is as of now underway however current tales point at it dumping Samsung’s hub for TSMC’s 4 nm process. That would make for an incredible problem as the Dimensity 10000 would be on a subjectively better hub. These are early days yet however we could be confronting a period of MediaTek strength.